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SoC Packaging Engineer

Apple· Hardware
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TaipeiFull-timePosted 7mo ago

About the role

Senior level advanced packaging engineer to develop new products by interfacing between internal design, process integration and external suppliers to deploy new packaging technologies from concept to high-volume manufacturing.

Responsibilities

  • Evaluate leading edge Photonic packaging technologies including characterization and improvement to Silicon Photonic performance, yield and reliability. Define package characteristics and specification, and solve device & yield issues from NPI to mass production.
  • Work with leading foundry, design house, assembly and optical suppliers on Co-package optics development from design, new material, new equipment selection and establish robust process of record. Perform initial proof of concept sample build, test vehicle validation, package and process qualification, yield and continuous improvement.
  • Interface and coordinate with other packaging team members to comply with product development & ramp schedule. Deliver product milestones on time.
  • Define packaging roadmap based on long term package product requirements. Work closely with suppliers and manage R&D activities.
  • At least 5~10% travel to domestic and international locations.

Qualifications

  • M.S or Ph.D. degree in Photonics, Physics, Materials science or similar disciplines with a minimum of 5 years of experience in high performance computing, data center and SiPH (silicon photonics) applications.
  • In-depth knowledge in advanced 2.5D/3D packaging for EIC/PIC die integration, Chip-on-Wafer processes, Photonic component assembly (FAU and fiber) and MCM module assembly.
  • Good understanding to optics and photonics fundamentals, device/module integration.
  • Knowledge in Optical device laser, modulator, photo detector, passive components is a plus.
  • Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
  • Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.

Skills

Required:Photonic packaging2.5D/3D packagingProject leadership / cross-functional coordination

Benefits

  • Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally.
  • Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.
  • Accessibility initiative information available at Apple Careers site.
Last updated Sep 18, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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