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DFM Engineer - PCBA

Apple· Operations and Supply Chain
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Hybrid (Bengaluru)Full-timePosted 7mo ago

About the role

Accomplished PCBA DFM engineer to lead development and ramp for a next generation Apple product, guiding PCBA manufacturability, process development, and collaboration with contract manufacturers to enable high-volume production.

Responsibilities

  • Attend development builds as required under direction of Operations Engineering Directly Responsible Individual (DRI)
  • Provide guidance and resources to contract manufacturing (CM) partner engineers
  • Act as project leader on a variety of complex projects
  • Plan, develop and implement technically complex procedures for PCBA manufacturing process, rework, and testing
  • Make recommendations for changes required in testing equipment (ICT and Functional test), manufacturing processes, and new testing requirements
  • Design and develop technically complex new processes to improve quality and efficiency
  • Provide early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling, influencing designs so that they are manufacturable, reducing complexity by using standard size packaging
  • Interface with Apple Printed Circuit Board Assembly (PCBA) Subcontractor and manage technical aspects of Volume Manufacturing builds including rework processes, with direction as necessary from Operations Engineering DRI
  • Ensure Apple PCBA Subcontractors/JDM partner adherence to Process Parameters and Procedures as well as approved Manufacturing and Test processes. Ensure maintenance of specified quality levels at PCBA Manufacturing sites

Qualifications

  • BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
  • 5+ years of experience in printed circuit assembly manufacturing processes.
  • Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
  • Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
  • Travel domestically and internationally to supplier sites – 60%
  • Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
  • Experience with the development and evaluation of various SMT processes
  • Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
  • Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
  • Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
  • Good team player with an ability to work with multiple cross-functional teams

Skills

Required:PCBA DFMSMT processProcess developmentProject managementCommunication
Nice to have:Failure analysis

Benefits

  • Accessibility-driven culture
  • Competitive benefits and tools fostering belonging and accessibility
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

AirPods Max 2Apple ArcadeApple CardApple Fitness+Apple MusicApple TVApple TV+Apple Watch Series 11
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