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Product Design Engineer - DFM SiP / PCBA NPI

Apple· Operations and Supply Chain
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Hybrid (Bengaluru)Full-timePosted 7mo ago

About the role

Engineer responsible for developing next-generation SiP process and PCBA assembly processes for various end products, leading OSAT process development during POC and NPI builds, and delivering high-quality SiP solutions to high-volume manufacturing.

Responsibilities

  • Collaborate with cross functional teams, to define next-gen SiP architecture based on assessment of functionality / form factor / process capability
  • Define general process flow and assess process risk per different options, co-work with internal RD team or OSAT team for early validation to de-risk and update risk level based on validation result
  • Work with internal project management team, to define NPI timeline, detailed bring up plan, formal build plan, post build plan and etc.
  • Take lead for process development in POC build & NPI build, drive OSAT process team to bring up each process steps (material down-selection, equipment qualification, tooling design, recipes fine tune), integrate as one robust process flow and deliver SiP with timely manner (based on NPI build plan) & high quality (yield, reliability)
  • Work with EE team & REL team for process related FA, take lead of process trouble shooting, commonality study, corrective actions and drive till closure
  • Drive OSAT team, material vendor, equipment vendor for potential process yield improvement, cost reduction, design rule improvement

Qualifications

  • Bachelors or Masters degree in Mechanical engineering, Physics, Materials Science or equivalent
  • 5 years of experience in IC packaging / Surface Mount Technology / Printed Circuit board assembly process
  • Solid knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials
  • Strong knowledge of SMT Processes, mechanical design, GD&T, Tolerance Analysis
  • Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing
  • Proven ability to lead internal or external team for assembly process development and qualification of semiconductor packages
  • Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP)
  • Ability to work under pressure with a wide range of people with varying degrees of experience
  • Familiar with quality tools, including SPC, Cpk, data distribution, data correlation, commonality study and etc
  • Excellent communication skills in English

Skills

Required:SiP process developmentPCBA NPI coordinationMTM/SMT processesGD&T and tolerance analysisProcess de-risking and validationData analysis and DOEQuality tools (SPC, Cpk)Communication

Benefits

  • Not explicitly listed in the job description
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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