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IC Packaging Integration Engineer

Apple· Hardware
Apply on company site
Hybrid (Austin, TX), Hybrid (Santa Clara, CA)$184.7k - $324.8kfull-timePosted 6mo ago

About the role

Versatile IC Packaging Engineer responsible for IC packaging development, leading SoC package integration and architecture efforts, and driving advanced packaging solutions, material developments, and specifications.

Responsibilities

  • You will be responsible for IC packaging development
  • Work with cross-functional teams and lead SoC Package integration and architecture efforts
  • Drive the industry with advanced package solutions, new material developments, and specs
  • Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.
  • Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).
  • Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
  • Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.
  • Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.

Qualifications

  • BS and 10+ years of experience in relevant industry experience
  • MS/PhD and 6+ years of experience in relevant industry.
  • We are looking for someone experienced in the semiconductor packaging and/or system integration.
  • Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
  • Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
  • Excellent problem solving with strong physics and fundamentals.
  • Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
  • Basic knowledge of signal integrity/power integrity.
  • Ability to review schematics, package/PCB layout and designs in Allegro.

Skills

Required:IC packaging developmentSoC package integrationAdvanced packaging technologies (FOWLP, 2.5D, 3D)DOE and statistical analysis
Nice to have:AI/ML for data analytics

Benefits

  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Range of discounted products and free services
  • Reimbursement for certain educational expenses — including tuition
  • Discretionary bonuses or commission payments (potential)
  • Relocation assistance (potential)
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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