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IC Package Integration Lead

Apple· Hardware
Apply on company site
Austin, TX, San Francisco Bay AreaFull-timePosted 6mo ago

About the role

Lead package integration and architecture efforts across cross-functional teams and with 3rd parties/OSAT to bring packaging solutions from concept to high-volume manufacturing, including package, module, and technology development. Manage teams and travel up to 5-10%.

Responsibilities

  • Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements.
  • Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost).
  • Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production.
  • Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.

Qualifications

  • BS and 10+ years of relevant industry experience.
  • Experience in Semiconductor Packaging Design, Process & Technology Development; managerial skills desirable.

Skills

Required:Cross-functional leadershipPackage co-design
Nice to have:Budget/people management
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

AirPods Max 2Apple ArcadeApple CardApple Fitness+Apple MusicApple TVApple TV+Apple Watch Series 11
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