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IC Package Integration Lead

Apple· Hardware
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Hybrid (San Francisco Bay Area, CA)$184.7k - $324.8kFull-timePosted 6mo ago

About the role

IC Packaging Engineering Lead responsible for leading package integration and architecture efforts with cross-functional teams and external partners, driving technology development from concept to high-volume production in semiconductor packaging.

Responsibilities

  • Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements.
  • Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost).
  • Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production.
  • Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.

Qualifications

  • BS and 10+ years of relevant industry experience.
  • Experience in Semiconductor Packaging Design, Process & Technology Development. Managerial skills highly desired.
  • Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
  • Knowledgeable in advanced packaging technologies: high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
  • Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.
  • Excellent problem solving with strong physics and fundamentals.
  • Excellent communication skills with internal cross-functional teams and overseas suppliers.
  • Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
  • Ability to work independently and take on projects with minimum supervision.
  • Ability to lead and manage teams.

Skills

Required:Package co-designCross-functional leadershipPackage technology developmentCAD tools (Cadence APD/Allegro)

Benefits

  • Comprehensive medical and dental coverage
  • retirement benefits
  • range of discounted products and free services
  • reimbursement for certain educational expenses including tuition
  • discretionary bonuses or commission payments and relocation may be available
  • employee stock programs including RSU and Employee Stock Purchase Plan
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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