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IC Packaging Engineer

Apple· Hardware
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Hybrid (Taipei)full-timePosted 6mo ago

About the role

Senior IC packaging engineer responsible for developing and deploying new packaging technologies by interfacing with product design, quality, supply chain, and external suppliers to bring packaging solutions from concept to high-volume manufacturing.

Responsibilities

  • Explore and evaluate packaging technologies to define new package characteristics and specifications based on module and system performance, cost, and footprint.
  • Collaborate with foundries, OSATs, and equipment/material suppliers on development of advanced wafer bumping, wafer level chip scale packaging, fcCSP and SiP integration from design, material selection, and equipment choice; perform proof of concept sample builds, package and process qualification, reliability tests, yield analysis and continuous improvement.
  • Interface and coordinate with cross-functional teams to meet product development and ramp schedules; deliver packaging POR and qualification milestones on time.
  • Collaborate with internal teams to define packaging roadmap based on long-term product requirements; manage supplier development activities.
  • Travel 5-10% to domestic and international locations.

Qualifications

  • M.S. or Ph.D. in mechanical engineering, physics, materials science or similar with minimum 5 years of IC packaging experience.
  • In-depth knowledge in wafer bumping, PM/RDL fan-in & fan-out & system-in-package integration; understanding of module processes such as Cu RDL, polymer passivation, advanced node wafer singulation and die-level processes.
  • Good understanding of Chip on Wafer hybrid or fusion bonding technologies (a plus).
  • Knowledge in wafer level CSP, fcCSP, SiP and their applications in power management, baseband, and RF.
  • Good understanding of advanced silicon node BEOL and device physics or component/board level reliability testing.
  • Proven track record of driving issue resolution with root-cause analysis; ability to perform independent R&D with minimal supervision.
  • Strong written and verbal communication skills; able to present ideas, designs, data, and plans confidently in internal/external meetings.

Skills

Required:Packaging technology developmentWafer bumpingWLP/FCSP/SiPReliability testingSupplier managementCommunication

Benefits

  • Equal opportunity employer; commitment to inclusion and diversity.
  • Reasonable accommodation for applicants with disabilities.
  • Accessibility initiatives and resources available in Apple’s workplace.
Last updated Sep 25, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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