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Process Engineer

Apple· Hardware
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Hybrid (San Francisco Bay Area, CA)$184.7k - $324.8kFull-timePosted 6mo ago

About the role

Senior Electronic Packaging Engineer within Apple's ATG Sensing Group focused on developing module packaging solutions for new consumer products, leading process development for New Product Introduction, and ensuring high-volume manufacturing with OSAT partners.

Responsibilities

  • Ownership of process equipment definition, process material selection, and process flow design for module packaging.
  • Own existing projects packaging process and materials. Evaluate process and materials impact of module packaging with system integration.
  • Develop new package process concepts to realize new module designs based on unique system requirements. Develop new package processes from Proof-of-Concept demonstrations to full production implementation.
  • Collaborate with reliability team and product design team to identify design and process issues with the use of FMEA.
  • Deep integration of simulations to validate design impact of process ahead of initiating process development.
  • Establish communication channels with module integrators and any key technical suppliers to accomplish project success.
  • Consolidate Major Issues List for each project to communicate with both internal and external parties.
  • Collaborate with program management teams to accomplish timely delivery of project.
  • Hand-off projects from engineering phase to operations team with clearly defined goals and deliverables.
  • Present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings.
  • Leverage AI to improve overall project efficiency.
  • Have passion in semiconductor packaging technology, self-motivated, capable of deep work with minimal supervision.

Qualifications

  • BS and 10+ years of relevant industry experience.
  • Understand and keep up-to-date with industry landscape on relevant technologies.
  • Strong interpersonal and team-building skills.
  • Proven track record of work with OSAT to bring products from conceptual to MP stage.
  • Strong materials science and failure analysis knowledge related to assembly chip-packaging interactions and reliability failures.
  • Proficient in applying DOE vs. Hypothesis tool for root cause analysis.
  • Excellent written and verbal communication skills.
  • In-depth knowledge in semiconductor sensor packaging technologies.
  • Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip chip and multi-die stacking), wirebond, encapsulation and underfill, SMT, transfer/compression molding, singulation, and wafer level packaging processes.
  • Working level knowledge in wafer bumping, RDL, and TSV.
  • Experience in using simulation to guide process setup.
  • Experience in using AI to support process development.
  • Experience in capacitive sensing module packaging.
  • Experience in customer facing cosmetic packaging.

Skills

Required:Process equipment definitionProcess material selectionProcess flow designDOE and root cause analysis

Benefits

  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Discounted products and free services
  • Reimbursement for certain educational expenses including tuition
  • Discretionary bonuses or commission payments and relocation may be eligible
Last updated Sep 18, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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