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Silicon Photonics & Optical Packaging Eng

Apple· Hardware
Apply on company site
Hybrid (San Francisco Bay Area), Hybrid (Austin)$184.7k - $324.8kfull-timePosted 6mo ago

About the role

Silicon photonics (SiPh) packaging engineer role focused on developing high-efficiency optical I/O module architecture and co-packaging solutions for SiPh interconnects, driving packaging baseline processes, BOM decisions, and optical coupling design/manufacturing to optimize performance, reliability, yield and cost.

Responsibilities

  • Lead Si photonics packaging technology development and work with cross-functional teams to drive optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts.
  • Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to high-volume manufacturing (HVM).
  • Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance.
  • Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.
  • Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.
  • Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs.
  • Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development.

Qualifications

  • BS and 10+ years of relevant industry experience
  • MS or PhD in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or equivalent (desired, preferred)
  • Excellent teamwork and communication skills
  • Strong theoretical background in optics and photonics fundamentals, device/module integration
  • Hands-on experience in packaging and measuring fiber-coupled devices
  • Hands-on experience in optical component design, simulation and qualification, and single/multi-mode fiber assembly using active and passive alignment tools
  • Minimum 5 years’ experience in related field with MS and/or PhD
  • Hands-on experience of CMOS BEOL wafer-scale processing and flip chip assembly (CoC, CoW, WLP, …)
  • Experience with silicon photonics device laser, modulator, PD, passive components (Si WG, MUX/DeMUX) is a plus

Skills

Required:Optical packaging designOptical simulation and modelingPrototyping and characterizationCross-functional collaboration
Nice to have:CMOS BEOL processing and flip chip assembly

Benefits

  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Discounted products and free services
  • Educational expense reimbursement (tuition)
  • Discretionary bonuses or commission potential
  • Relocation assistance
  • Employee stock plan eligibility (RSU)
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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