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Memory Packaging Engineer

Apple· Hardware
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Santa Clara$129.3k - $225.3kFull-timePosted 5mo ago

About the role

Memory Packaging Engineer responsible for architecting and qualifying next-generation memory packages, defining package roadmaps with memory partners, and collaborating cross-functionally to enable bandwidth and density scaling across Apple products.

Responsibilities

  • Determine the direction of next-generation package architecture by evaluating available and emerging packaging technologies.
  • Collaborate with cross-functional teams to solve integration challenges, including electrical, mechanical, and thermal.
  • Drive vendor DOEs and failure analysis to improve downstream yield and maintain world-class quality and reliability.
  • Define the memory package POR (plan of record): Package form factor, process, layout, stackup, and bill of materials (BOM).
  • Drive memory vendors to develop package materials and technology for leading-edge package design rules.

Qualifications

  • Minimum requirement of a bachelor's degree in a relevant field
  • MS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.
  • Strong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding.
  • Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.
  • Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
  • Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.
  • Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.
  • Excellent communication skills for collaborating with internal teams and managing external vendors.

Skills

Required:Memory package architectureCross-functional collaborationVendor management and DOEPackage POR definitionThin-die stacking technologiesPackaging materials and warpage/CTESI/PI co-design with memory dieMemory die floorplan & architecture influenceCommunication

Benefits

  • Comprehensive medical and dental coverage
  • retirement benefits
  • a range of discounted products and free services
  • reimbursement for certain educational expenses — including tuition
  • discretionary bonuses or commission payments and relocation may apply
  • Apple shareholder opportunities through stock programs
Last updated Jul 3, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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