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3D IC and ADVANCED PACKAGING CAD ENGINEER

AMD· Engineering
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Markham, ONCA$105.6k - CA$158.4kFull-timePosted 4mo ago

About the role

Role focused on implementing and evolving 3D-IC design and advanced packaging CAD flows, integrating AI capabilities into CAD workflows, and collaborating with global teams and EDA vendors to meet QoR targets in silicon hardware design.

Responsibilities

  • Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.
  • Develop and integrate end-to-end AI capabilities into CAD flows — including ML-based optimization, predictive modeling, and LLM-assisted automation.
  • Build and deploy agentic AI systems that automate multi-step design and verification tasks.
  • Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, best practices, and AI co-development opportunities.
  • Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.
  • Regress methodology, analyze results, and develop capabilities that measurably improve quality of results.
  • Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance.

Qualifications

  • Strong experience in 3D-IC design and advanced packaging technologies.

Skills

Required:3D-IC designSynopsys 3DIC CompilerEDA tools (Synopsys, Cadence)AI in CAD/EDAScripting (Python, TCL, Perl)Communication
Nice to have:LLM-based tools / agentic AIVerilog, RTL, UPFDistributed/Cloud compute

Benefits

  • See AMD benefits at a glance
Last updated Oct 22, 2026. Interested? Apply on the company site.
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