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Integrated Circuit - Packaging Architect Engineer

AMD· Engineering
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San Jose, CA$209.6k - $314.4kFull-timePosted 4mo ago

About the role

Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Collaborates with product design teams and technology development partners to define a packaging roadmap, architecture, DFM/DFY guidelines, and lead technology development initiatives from concept to qualification. Responsible for cross-functional leadership, executive communications, and engagement with ecosystem partners to address yield, reliability, and process development challenges.

Responsibilities

  • Work with product architects in early definition stage to understand and define package architectures, roadmap
  • Lead new package technology development initiatives from concept to full technology qualification
  • Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
  • Establish Yield roadmap and lead implementation of yield, data analytic tools as need

Qualifications

  • Experience in semiconductor technology development role
  • Experience working with manufacturing partners such as suppliers, OSATs and foundry partners
  • In-depth knowledge in material science, thin film process development, and/or packaging
  • Experience in a leadership role driving cross-functional teams
  • Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment

Skills

Required:Packaging architectureDesign for Manufacturing (DFM)Design for Yield (DFY)Cross-functional leadershipExecutive communication

Benefits

  • AMD benefits at a glance
Last updated Oct 22, 2026. Interested? Apply on the company site.
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