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Sr. Manager Packaging Engineering

AMD· Engineering
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MARKHAM, CanadaCA$153.6k - CA$230.4kFull-timePosted 3mo ago

About the role

Senior leadership role driving end-to-end packaging design programs for Data Center GPU and MI initiatives, leading cross-functional teams and accelerating through AI-enabled methodologies while ensuring schedule, quality, and cost targets.

Responsibilities

  • Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.
  • Drive execution in fast-paced, dynamic, and high-pressure environments, managing competing priorities across programs.
  • Establish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.
  • Interface with senior leadership to provide clear program status, risks, and mitigation strategies.
  • Lead, mentor, and grow a high-performing team of package design engineers across geographies.
  • Foster a culture of accountability, innovation, and continuous improvement aligned with AMD engineering excellence.
  • Conduct performance reviews, talent development planning, and succession management.
  • Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.
  • Engage with OSAT and substrate vendors to drive design feasibility, manufacturability, and yield optimization.
  • Define and drive improved design methodologies, workflows, and best practices to enhance execution efficiency.
  • Champion adoption of AI/ML-enabled tools and automation (e.g., layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making.
  • Scale digital transformation initiatives within the package design organization.

Qualifications

  • Experience in semiconductor package design, with strong focus on high-performance or data center products.
  • Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.
  • Strong understanding of package layout, high-speed design considerations, and multi-die integration.
  • Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).
  • Excellent leadership, communication, and stakeholder management skills.
  • Demonstrated ability to handle ambiguity, drive decisions, and deliver under pressure.
  • Experience working with OSATs, substrate vendors, and manufacturing partners.
  • Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.
  • Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).

Skills

Required:Program managementLeadershipPackage designOSAT/substrate/vendor collaborationIndustry tools (3DICC, Cadence SiP/APD)
Nice to have:AI/ML in engineering workflowsData Center GPU / HPC knowledge
Last updated Oct 22, 2026. Interested? Apply on the company site.
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