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AI Automation Design Packaging Lead

AMD· Engineering
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Hybrid (Austin, TX)$162.8k - $244.2kFull-timePosted 3mo ago

About the role

Lead the development and deployment of AI-driven packaging design automation for advanced heterogeneous integration technologies (substrates, organic interposers, bridge interconnects) at AMD. Drive design automation, AI/ML workflows, and transition to agentic/algorithmic design models while collaborating across Design, EDA, and AI teams.

Responsibilities

  • Drive the development, deployment, and maintenance of AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
  • Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
  • Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
  • Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
  • Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
  • Mentoring junior engineers in coding best practices and advanced packaging concepts.

Qualifications

  • Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

Skills

Required:Python
Nice to have:TclC++AI/ML Frameworks

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 22, 2026. Interested? Apply on the company site.
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