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Packaging Engineer

AMD· Engineering
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HsinchuFull-timePosted 3mo ago

About the role

MTS role in AMD packaging design focusing on AI-driven automation workflows to improve efficiency, quality, and scalability of complex package, bridge, and interposer design for advanced heterogeneous integration technologies.

Responsibilities

  • Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.
  • Apply AI/ML methodologies to enhance design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.
  • Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.
  • Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement
  • Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams
  • Support execution of design milestones and tape-outs, ensuring automation readiness and quality
  • Contribute to documentation, best practices, and reusable workflows for broader team adoption

Qualifications

  • Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.

Skills

Required:Automation scriptingPythonAI/ML for engineering workflowsEDA tools knowledgeDesign for packaging

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 22, 2026. Interested? Apply on the company site.
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