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Staff Process Technology Integration Engineer

AMD· Engineering
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SingaporeFull-timePosted 3mo ago

About the role

Role focused on interfacing with HBM/DRAM vendor teams and foundries to drive process integration improvements, yield, reliability, and performance for AMD’s HBM and processor fabrication across multiple technology nodes. Requires collaboration with external suppliers and AMD internal teams to evaluate and implement process changes and analyze test data and failure mechanisms.

Responsibilities

  • - Provide expertise in process and integration for advanced Front/Middle/Back End Of line modules
  • - The above applies to both HBM/DRAM as well as logic process flows
  • - Detailed review of systematic defect and parametric signatures with the HBM vendor/silicon foundry, and oversight of F/M/BEOL issues across products and technology nodes.
  • - Jointly design and analyze process improvement (CIP/BKM) evaluations run at the HBM vendor/silicon foundry. Provide technical assessment for AMD process change review board for CIP/BKM roll-out decisions.
  • - Hands-on basic product yield analysis (hardbin, softbin & parametric data) as well as foundry WAT/ electrical test parameter analysis. Ability to understand test data from both HBM and logic test flows.
  • - Close collaboration with device analysis teams to understand structural and parametric fail mechanisms for yield loss, potential reliability and quality issues, and deduce process failure mechanisms.
  • - Interface with supplier quality & reliability engineering teams to provide technical inputs for potential process excursions/material review board, as well as to assess the root cause of reliability/HTOL fails and drive the right corrective actions in the process flow with the HBM vendor/silicon foundry.
  • - Maintaining the overall F/M/BEOL "technology encyclopedia" for current technology nodes (on memory & logic), including failure analysis/defect pareto/process change history and speculative process flows.
  • - Keeping abreast of forward-looking industry trends in wafer fab process integration (HBM/DRAM & logic), unit processes, materials and fabrication equipment, as well as competitive analysis/teardowns.

Qualifications

  • Bachelor's, Master’s or Ph.D. degree preferred in Electrical Engineering, Chemical Engineering, Materials Science and Engineering or Physics/Chemistry
  • - Professional experience in the semiconductor industry across multiple technology nodes/generations
  • - Experience with advanced semiconductor technologies for HBM/DRAM fabrication OR on FinFET technology nodes. Must be able to understand and explain basic process flows on both products. Direct experience in both memory & logic products is highly valuable.
  • - Hands on experience in unit process modules and/or process integration, which can include one or more of FEOL (isolation, gate stack, patterning, epi), MEOL (replacement gate, contact) or BEOL (interconnect).
  • - Knowledge of PFA and FI techniques used in Device Analysis, including the ability to deduce fail mechanisms and process steps used.
  • - Strong communication skills to interact with external vendors/foundries and internal teams across time zones.

Skills

Required:Process integrationYield analysis

Benefits

  • Benefits offered are described: AMD benefits at a glance (link provided in description).
Last updated Oct 15, 2026. Interested? Apply on the company site.
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