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Integrated Circuit - Packaging Architect Engineer

AMD· Engineering
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Austin, TX$162.8k - $244.2kFull-timePosted 2mo ago

About the role

Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Defines packaging roadmaps, architecture, DFM/DFY guidelines, and leads cross-functional technology development initiatives from concept to qualification.

Responsibilities

  • Work with product architects in early definition stage to understand and define package architectures, roadmap
  • Lead new package technology development initiatives from concept to full technology qualification
  • Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
  • Establish Yield roadmap and lead implementation of yield, data analytic tools as need

Qualifications

  • Experience in semiconductor technology development role
  • Experience working with manufacturing partners such as suppliers, OSATs and foundry partners
  • In-depth knowledge in material science, thin film process development, and/or packaging
  • Experience in a leadership role driving cross-functional teams
  • Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment

Skills

Required:Packaging architectureDesign for Manufacturing (DFM)Design for Yield (DFY)Cross-functional leadership

Benefits

  • AMD benefits at a glance
Last updated Oct 15, 2026. Interested? Apply on the company site.
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