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2027 Undergrad ASIC Package Engineering Co-op/Intern

AMD· Engineering
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Hybrid (Multiple locations (Austin, TX; Boxborough, MA; Fishkill, NY; Fort Collins, CO; Longmont, CO; Secaucus, NJ))$59.1k - $880.6kUNAVAILABLEPosted 2mo ago

About the role

ASIC Package Engineering intern/co-op role at AMD focused on design, development, verification, and yield improvement for packaging technologies. Full-time during term, onsite or hybrid locations in multiple US cities.

Responsibilities

  • Support Package design and Package Development Engineers in prioritizing and optimizing new projects
  • Train to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
  • Work on design verification implementation to ensure design performance, quality and efficiency
  • Analyze yield and defect metrics to ensure design performance and help improve yield
  • Evaluate, benchmark packaging materials and interact with partners to achieve cost-efficient designs and materials for best performance and yield requirements

Qualifications

  • Currently enrolled in a US-based University in a Bachelor's degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or related field

Skills

Required:Transmission lines and electric circuitsPackage, silicon or PCB design software
Nice to have:Scripting languagesSemiconductor theory and packaging process/technologyData analytics and data visualization tools

Benefits

  • Benefits offered are described: AMD benefits at a glance
Last updated Oct 22, 2026. Interested? Apply on the company site.
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