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Packaging Engineer

Apple· Hardware
Apply on company site
San Francisco Bay Area$184.7k - $324.8kfull-timePosted 1mo ago

About the role

Senior IC packaging engineer to develop custom silicon packaging solutions in a module/system for consumer markets. Interfaces with internal teams and external suppliers to deploy new packaging technologies and bring products from concept to high-volume manufacturing.

Responsibilities

  • Define new package characteristics based on module and system level performance, cost, and footprint requirements.
  • Define package/packaging specifications.
  • Work with external suppliers on package design, new material, new equipment selection and process flow development.
  • Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement.
  • Coordinate with other packaging and cross-functional team members to comply with product development/ramp schedule.
  • Deliver package/packaging milestones on time.
  • Define packaging roadmap based on long term packaged product requirements.
  • Work closely and manage suppliers’ R&D activities.

Qualifications

  • BS and 10+ years of relevant industry experience.
  • MS or Ph.D. in mechanical engineering, physics, materials science or similar with minimum 10 years of IC packaging experience; AutoCAD, APD and multi-physics simulation knowledge a plus.
  • Industry experience and work on WLP in IDM or Fabless companies.
  • Knowledge and hands-on experience on Wafer Bumping and Dielectric materials and their pros/cons.
  • Hands-on knowledge in Manufacturing assembly processes (wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation, Tape & Reel).
  • In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly for Fan-In & Fan-Out designs).
  • Good knowledge on Package Qualification and Reliability testing.
  • Expert level knowledge of common reliability failure modes and device physics for reliability testing at device/board level.
  • Proven track record to bring a product/package from conceptual stage to development and to HVM environment.
  • Ability to construct Design of Experiments and down-select materials and processes.
  • Good written and verbal communication skills; able to present ideas and data at team and executive reviews.
  • Ability to perform independent research and development with minimal supervision.

Skills

Required:Package design and specificationsWafer BumpingWafer Level Chip Scale Packaging (WLCSP)Manufacturing assembly processesPackage Qualification and Reliability testingDesign of Experiments (DOE)Cross-functional collaboration

Benefits

  • Comprehensive medical and dental coverage
  • retirement benefits
  • discounted products and free services
  • education reimbursement including tuition
  • potential discretionary bonuses or commission payments
  • relocation assistance
  • Employee Stock Purchase Plan
Last updated Aug 28, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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