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Packaging Engineer

AMD· Engineering
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Hybrid (Hsinchu, Taiwan)Full-timePosted 1mo ago

About the role

Role focused on external manufacturing operations and supplier engagement for flip chip bumping/fan out/RDL/on-substrate assembly in a semiconductor environment. Drives new product introduction, yield improvement, issue resolution, and continuous improvement with external manufacturers.

Responsibilities

  • Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness.
  • Drive external manufacturer on issue resolution and issue prevention with leading indicators to proactively identify risks
  • Timely execution of special work requests, with comprehensive reports.
  • Monitor performance of external manufacturing site regarding yield, out of control lots, disposition, and outliers reporting.
  • Plan and execute change management from internal or external parties.
  • Proactively identify improvement opportunities and drive continuous improvement in process simplification and quality enhancement, internal and external environments.
  • Occasionally to support on site audit and travelling.
  • May involve in regional supplier management.
  • Assist in additional duties as deemed fit by supervisor.

Qualifications

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
  • Strong knowledge in Bumping/fan out/RDL process (Flip Chip assembly, advanced package is an added advantage)
  • Proven experience in process development, qualification, and high-volume manufacturing within a semiconductor ASIC environment
  • Familiar with tools (AI agents, JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standards (ESD, Jedec, Automotive)
  • Good leadership and interpersonal relationship
  • Good English speaking, communication, and writing skills

Skills

Required:Supplier engagementNew Product Introduction planningIssue resolution and preventionChange management
Nice to have:Process improvement

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 22, 2026. Interested? Apply on the company site.
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