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Packaging Engineer, Substrate

AMD· Engineering
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Hybrid (Hsinchu, Taiwan)Full-timePosted 1mo ago

About the role

Proactive role in External Manufacturing Operations (Substrate) focusing on ensuring stable IC substrate supply for a leading CPU/GPU company, driving NPI/production readiness, process optimization, yield improvement, business continuity and supplier collaboration.

Responsibilities

  • Supplier Management: Manage substrate supplier from NPI bring up/qualification to production release; Substrate supplier’s new production site bring up & qualification; Oversee NPI/LVM/HVM yield monitoring, sustaining, and improvements; Drive HVM yield attainment and sustaining issue resolution and prevention through data analytics and corrective actions; Lead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs); Monitor supplier performance using scorecards and lead quarterly technical reviews to ensure improvements; Lead projects to drive cross supplier performance improvement/quality enhancement.
  • Additional Responsibilities: Ad hoc tasks as assigned by the supervisor based on business needs.

Qualifications

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
  • Experience in IC Substrate industries (preferred)
  • Technical expertise in FC-BGA, LGA substrate manufacturing, assembly, and test processes (preferred)
  • Experience in substrate development from NPI to HVM (preferred)
  • Strong statistical knowledge (DOE, SPC, 6 Sigma) and data analysis/technical report writing
  • Strong interpersonal communication and teamwork skills
  • Solid time management and project management skills

Skills

Required:NPI managementSupplier managementData analysis
Nice to have:DOE/ SPC / 6 Sigma

Benefits

  • Benefits described at AMD benefits at a glance (linked)
Last updated Oct 22, 2026. Interested? Apply on the company site.
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