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Senior Staff Advance Packaging Designer

AMD· Engineering
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Hybrid (Singapore)Full-timePosted 1mo ago

About the role

Senior-level package design engineer at AMD focused on advanced packaging (2.5D/3D, chiplet-based architectures) leveraging AI-driven design techniques, automation, and next-generation workflows to address complex heterogeneous integration.

Responsibilities

  • Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
  • Handle multiple concurrent design programs in a fast-paced and high-pressure environment
  • Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
  • Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams
  • Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
  • Interface with stakeholders to communicate design status, risks, and mitigation strategies
  • Contribute to design reviews, signoff readiness, and tapeout processes
  • Define and enhance package design methodologies, flows, and best practices
  • Drive improvements in layout efficiency, reuse, and design standardization
  • Mentor junior engineers and promote engineering excellence across the team

Qualifications

  • Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field

Skills

Required:Package design executionSubstrate layoutsCollaboration with SI/PI, mechanical, SOC
Nice to have:AI/ML in design

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 8, 2026. Interested? Apply on the company site.
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