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Mechanical Engineer

AMD· Engineering
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San Jose, CA$200k - $300kFull-timePosted 1mo ago

About the role

Role within AMD's Advanced Packaging team developing mechanical solutions for next-generation semiconductor packages, collaborating across packaging, thermal, reliability, manufacturing and supply-chain to bring concepts to production.

Responsibilities

  • Support development of advanced semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
  • Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews.
  • Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements.
  • Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure product quality and manufacturability.
  • Support thermo-mechanical modeling and package integration activities using tools such as Creo and ANSYS Mechanical.
  • Contribute to chip, package, board, and system-level integration efforts.
  • Partner with packaging, thermal, reliability, manufacturing, and supply-chain teams throughout product development and ramp.
  • Support development of next-generation packaging, cooling, and materials technologies for future AMD products.

Qualifications

  • Semiconductor packaging experience supporting ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products.
  • Experience with mechanical design, CAD modeling, GD&T, tolerance analysis, DFM, and design reviews.
  • Familiarity with thermo-mechanical modeling using ANSYS Mechanical or similar tools.
  • Understanding of chip-package interaction, package-board interaction, and semiconductor package integration.
  • Experience working with suppliers, contract manufacturers, or packaging development partners.
  • Knowledge of advanced packaging technologies and manufacturing processes.
  • Experience with advanced cooling solutions, thermal technologies, or emerging packaging materials is a plus.

Skills

Required:Semiconductor packaging experienceMechanical design and CAD modelingThermo-mechanical modelingChip-package and package-board interactionSupplier/CM collaborationAdvanced packaging technologies
Nice to have:Thermal technologies / cooling
Last updated Oct 8, 2026. Interested? Apply on the company site.
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