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Principal ASIC Package Design Engineer

K2 Space· Silicon
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Seattle, WA$200k - $280kFull-timePosted 1mo ago

About the role

Lead advanced ASIC package architecture and execution with a focus on FC-BGA and MCM solutions, owning the end-to-end package strategy for high-performance mixed-signal and digital SoCs from architecture through production ramp, and acting as the technical authority for package design.

Responsibilities

  • Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
  • Establish organizational package design standards, methodologies, and best practices.
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
  • Own package-level SI/PI strategy, including high-speed digital interfaces (e.g., SerDes, JESD, Interlaken), PDN design, and decoupling strategy.
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
  • Manage relationships with external packaging vendors, substrate suppliers, and OSATs, including vendor qualification, capability assessment, contract negotiation, and performance/quality score carding.
  • Drive material selection, substrate technology choices, and assembly process optimization.

Qualifications

  • Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or related field.
  • 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies.

Skills

Required:FC-BGA packaging designSubstrate technology and materialsSI/PI and EM simulation tools
Nice to have:MCM and heterogeneous integration

Benefits

  • Base salary range for this role is $200,000 – $280,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision coverage, life insurance, paid parental leave, and many other perks
Last updated Sep 16, 2026. Interested? Apply on the company site.

About K2 Space

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