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Advanced Packaging Technologist (Mechanical Modeling)

AMD· Engineering
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Austin, TX$145.4k - $218kFull-timePosted 4w ago

About the role

Package-centric Mechanical Modeling Architect role focused on defining next-generation packaging-platform architectures through model-based decision making and STCO, developing and validating mechanical and multi-physics models to guide package/board-level architecture and integration of electro-thermal and electro-optical capabilities for data center platforms.

Responsibilities

  • Drive model-based architecture and design decisions for development and qualification of advanced package technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
  • Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
  • Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies.
  • Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • Define targets and strategic direction for mechanical and package technology development, assess technology readiness, and influence product roadmaps.
  • Serve as a mechanical & multi-physics subject-matter expert for package and board-level architectures with a primary focus on data center platforms.

Qualifications

  • MS or PhD in relevant Engineering disciplines or physics
  • Demonstrated experience owning model-based architecture & design decisions, supported by board-, package-, and system-level mechanical and multi-physics modeling, characterization and validation.
  • Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control, and assembly constraints.
  • Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first-principles understanding to multi-physics package-and-system-level design & assembly trade-offs.
  • Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
  • Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
  • Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.
  • Track record of influencing experimental test plans and correlating simulation with physical test data (e.g., DOE design, instrumentation selection, or lab collaboration for model validation).
  • Experience guiding or leading failure analysis investigations, translating FA/root-cause findings into design rules or model updates.
  • Familiarity with AI/ML-based engineering workflows, such as surrogate/reduced-order modeling, automated optimization pipelines, or ML-assisted anomaly/failure detection applied to physics-based data.

Skills

Required:Model-based architecture & designMechanical and multi-physics modelingPCB technologies and high-layer-count designsFinite Element Analysis (FEA)

Benefits

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Last updated Oct 15, 2026. Interested? Apply on the company site.
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