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Advanced Package Thermal Technologist

AMD· Engineering
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Hybrid (Austin, Texas)$145.4k - $218kFull-timePosted 4w ago

About the role

Package-centric Thermal Modeling Architect role focused on defining and driving next-generation packaging-platform architectures through model-based decision making and System-Technology Co-Optimization (STCO), developing and validating thermal models to guide SoC/package/board-level architecture and integration of electro-thermal and electro-optical capabilities.

Responsibilities

  • Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
  • Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
  • Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • Define targets and strategic direction for thermal and package technology development, assess technology readiness, and influence product roadmaps.
  • Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.

Qualifications

  • MS or PhD in relevant Engineering disciplines or physics.

Skills

Required:Model-based architecture & design decisionsThermal/CFD first-principles modelingPCB technologies & assembly constraintsElectro-thermal & electro-optical integration
Last updated Oct 22, 2026. Interested? Apply on the company site.
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