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IC Package Design Engineer

Apple· Hardware
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Hybrid (Austin Metro Area, TX), Hybrid (Los Angeles, CA), Hybrid (San Francisco Bay Area, CA)Full-timePosted 4w ago

About the role

Package design engineer responsible for physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. Focus on architecture, scalability, efficiency, automation and AI-driven design methodologies, with cross-functional collaboration to optimize SI/PI performance from concept to tape-out.

Responsibilities

  • Perform physical layout of package substrates for diverse silicon, including System-on-Chip (SoC), Memory, RF, and cellular integrated circuits (ICs).
  • Execute parasitic extraction (RLGC) and S-parameter modeling to validate that package designs meet Signal and Power Integrity (SI/PI) performance targets.
  • Lead cross-functional collaboration on package feasibility and system co-optimization; align with Product Design on chip floorplan, System Architecture on package configuration, and Silicon/SIPI teams on electrical performance.
  • Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows to enhance efficiency and streamline the release process.

Qualifications

  • BS and 10+ years of relevant industry experience
  • Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
  • High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).
  • Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology
  • Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

Skills

Required:Physical layout of package substratesParasitic extraction and S-parameter modelingCAD tools (Cadence Allegro, Mentor Xpedition)Verification tools (Calibre, CAM350)High-Speed & SI/PI analysisParasitic extraction (RLGC, S-parameters)Manufacturing & DFMAutomation & Scripting (Python, Perl, TCL)

Benefits

  • Equal opportunity employer with commitment to inclusion and diversity.
  • Accessibility and reasonable accommodations programs (EEO, accessibility resources)
Last updated Sep 25, 2026. Interested? Apply on the company site.

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