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SOC Thermal Engineer

Apple· Hardware
Apply on company site
Hybrid (Austin Metro Area, Texas, United States), Hybrid (San Francisco Bay Area, California, United States)Full-timePosted 3w ago

About the role

Thermal engineer role focused on optimizing mobile device thermal performance, IC packaging research, and development of cooling solutions for high-performance computing systems. Involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Responsibilities

  • Thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling
  • Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels
  • Analyzing simulation and measurement results to enhance product thermal management
  • Integrate cooling solutions to next generation SOC architecture design
  • Design and validate cooling solutions for high-performance computing systems
  • Simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines

Qualifications

  • BS + 10 years of industry experience
  • MSEE + 10 years of industry experience, preferred
  • Demonstrated leadership capabilities at the senior engineer level
  • Deep expertise in thermal design for silicon devices and packaging solutions
  • Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies
  • Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches
  • Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics
  • Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs
  • Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
  • Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk
  • Experience designing and executing experimental test setups and analyzing thermal data

Skills

Required:Thermal designThermal analysisIC packaging knowledgeSoC design methodologiesExperiment design and data analysis
Nice to have:Thermal testing
Last updated Oct 2, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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