← All roles

Packaging Engineer

AMD· Engineering
Apply on company site
Hsinchu, TaiwanFull-timePosted 2w ago

About the role

Senior/Manufacturing Test Specialist (SMTS) Packaging Engineer role focusing on leading assembly technology development with OSAT and foundry partners, and driving industry-wide technology development to meet future requirements.

Responsibilities

  • Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables.
  • Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.
  • Establish ecosystem partners to identify assembly capability improvement roadmap

Qualifications

  • Minimum MSc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.
  • Demonstrated leadership skills in managing OSATs and teams with various backgrounds
  • In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc..
  • Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.
  • Well verse in typical technology development tools, FMEA, SPC, control plans, etc..
  • Ability to communicate well in both English and Chinese language

Skills

Required:assembly technology developmentdie prepdie bond methods
Nice to have:underfill

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 22, 2026. Interested? Apply on the company site.
AMD logo

About AMD

together we advance_AI

AMD delivers leadership high-performance and adaptive computing solutions to advance data center AI, AI PCs, intelligent edge devices, gaming, & beyond.

AIData CenterHigh-Performance ComputingGamingEdge Devices
Company profileWebsite

More open roles at AMD