3D IC and SoC CAD ENGINEER
Hybrid (Austin, TX), Austin, TX$144.8k - $217.2kFull-timePosted 2w ago
About the role
The CAD team at AMD delivers automation and advanced flows for 3D IC stack and advanced packaging design, including 3D netlist, physical design, EMIR/PERC/ESD, physical verification, and STA. The role focuses on implementing and integrating AI-enabled CAD flows, collaborating with design teams and EDA vendors, and advancing 3D-IC and packaging capabilities.
Responsibilities
- Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.
- Lead hands-on debug and automation involving large chip level physical and logical netlists.
- Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, enhancement requests, and AI co-development opportunities.
- Partake in deep-dive discussions to provide guidelines to various organizations across AMD.
- Develop and integrate end-to-end AI capabilities into CAD flows — including ML-based optimization, predictive modeling, and LLM-assisted automation.
- Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.
- Regress methodology, analyze results, and develop capabilities that measurably improve quality of results.
- Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance.
Qualifications
- Bachelor’s or Master’s degree in computer engineering or Electrical Engineering
- Strong silicon hardware design background, scripting proficiency, and experience applying machine learning to CAD/EDA workflows
Skills
Required:EDA tools (ICC2, Innovus, Primetime)Chip/system-level netlists debuggingPython, TCL, Perl scripting
Nice to have:System-level design verification (LEC, LVS, DRC)AI/ML in CAD/EDAAdvanced-node tapeouts
Benefits
- AMD benefits described at a glance (link provided)
Last updated Oct 22, 2026. Interested? Apply on the company site.
About AMD
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