Staff Server Platform Hardware Architecture
BangaloreFull-timePosted 1w ago
About the role
Principal Member of Technical Staff role in High Speed Board Design & Server Platform Architecture at AMD, Bangalore. Senior individual contributor leading complex multi-layer PCB designs, architecture definition, and technical leadership across hardware programs for high-performance computing/data center platforms.
Responsibilities
- Lead the end-to-end design of high-speed, high-complexity PCBs including schematic capture, component selection, layout guidance, and design verification
- Design and review high-speed interfaces including PCIe Gen 4/5/6, DDR4/5/LPDDR5, USB 3.x, MIPI, SERDES-based interfaces, Ethernet (1G/10G/25G/100G), and other emerging standards
- Develop and own design specifications, interface requirement documents, and schematics for complex multi-layer boards (20+ layers)
- Define and enforce PCB stack-up, impedance control, and routing rules for high-speed signal integrity compliance
- Drive board bring-up, debug, and validation activities
- Perform or guide pre-layout and post-layout SI/PI simulations
- Work with PCB layout engineers to ensure design intent is implemented with detailed reviews
- Participate in early-stage architecture definition and feasibility assessment for new platform programs
- Evaluate new silicon devices, connectors, memory technologies, and interface standards
- Define reference design guidelines and best practices for high speed board design
- Identify and propose design improvements to reduce cost, improve reliability, extend product life, or enhance testability
- Stay current with industry trends and evolving EDA tool capabilities
- Serve as technical authority for high speed board design within the team
- Provide technical guidance, design reviews, and mentorship to junior engineers
- Lead design reviews and ensure manufacturability and compliance with system requirements
- Collaborate with cross-functional teams (SI, firmware, mechanical, test, silicon) and vendors
- Define and maintain design standards, checklists, and review processes for high speed board design
- Champion DFM/DFT/DFR practices and drive continuous improvement in design methodology
- Support sustaining engineering activities including ECO management and alternate component qualification
Qualifications
- 15+ years of hands-on experience in PCB hardware design, with a focus on high-speed digital systems
- Demonstrated experience designing complex, multi-layer PCBs (16+ layers) for HPC, server, networking, or semiconductor test platforms
- Proven track record delivering hardware designs from concept through mass production or deployment
- Bachelor's degree in Electrical/Electrical Engineering or related field; Master's preferred
- Deep expertise in high-speed interface design (PCIe Gen 4/5, DDR4/5, USB 3.x, SERDES)
- Strong hands-on SI/PI analysis and pre/post layout simulations
- Schematic capture proficiency (Cadence Allegro/OrCAD, Mentor PADS)
- Experience guiding PCB layout engineers, routing, stack-up, vias, differential pairs
- Experience with board bring-up and hardware debug (oscilloscope, logic analyzer, VNA, TDR)
- Familiarity with EMI/EMC, thermal design, DFM/IPC standards
- Exposure to FPGA-based boards and high-speed optical/SerDes interfaces (bonus)
Skills
Required:High-speed PCB designPCIe Gen 4/5/6DDR4/5Schematic capture toolsSignal integrity analysisPower integrity analysis
Benefits
- Benefits described in AMD benefits at a glance
Last updated Oct 15, 2026. Interested? Apply on the company site.
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