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2027 Masters Thermal Engineering Intern/Co-Op

AMD
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Santa Clara, CA$83.2kUNAVAILABLEPosted 1w ago

About the role

Thermal engineering intern/co-op at AMD focusing on development and validation of advanced cooling technologies for AI, HPC, and data center platforms. Hybrid/onsite/remote structure with multiple term options and competitive compensation.

Responsibilities

  • Thermal and hydraulic characterization of cooling solutions (cold plates, manifolds, heat exchangers, coolant loops, rack-level cooling).
  • Evaluate air-cooled and liquid-cooled platforms via thermal, airflow, coolant-flow, and pressure-drop analyses.
  • Support laboratory testing, instrumentation setup, sensor deployment, data acquisition, and thermal validation activities.
  • Develop scripts/tools to automate test execution, data processing, engineering analysis, and reporting.
  • Conduct thermal modeling, simulate and compare measured data against design expectations to identify trends and drive improvements.
  • Investigate thermal, flow, and power-related issues and collaborate with engineering teams to implement solutions.
  • Document technical findings and communicate results through reports, presentations, and technical documentation.

Qualifications

  • Currently enrolled in a U.S.-based university pursuing a Master’s degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or related engineering discipline.
  • Knowledge or experience in: heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, and engineering analysis.
  • Thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, coolant flow systems.
  • Laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, experimental validation methodologies.
  • CAD software such as SolidWorks or Creo.
  • CFD software or thermal simulation tools (e.g., ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM).
  • Analytical, problem-solving, communication, and technical documentation skills.
  • Exposure to AI infrastructure, HPC systems, server technologies, data center platforms, or energy-efficient cooling is a plus.

Skills

Required:Heat transferThermal analysisCAD (SolidWorks/Creo)Analytical and communication skills
Nice to have:Laboratory testingCFD/thermal simulation
Last updated Oct 15, 2026. Interested? Apply on the company site.
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