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Silicon Design Engineer

AMD· Engineering
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HsinchuFull-timePosted 1w ago

About the role

Hands-on automation engineer to drive AI-driven workflows and packaging design automation for advanced heterogeneous integration technologies (substrates, organic interposers, bridge interconnects) at AMD in Hsinchu, Taiwan.

Responsibilities

  • Develop, deploy, and maintain AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
  • Apply AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Work with EDA vendors and internal stakeholders to evaluate and implement next-generation features for 2.5D and 3D packaging.
  • Contribute to the transition from manual design practices to "Agentic" and algorithmic design workflows.
  • Collaborate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Document and report automation efficiency gains, ROI, and tool-capability improvements.
  • Collaborate with cross-functional teams to support critical design tape-outs and methodology milestones.
  • Share coding best practices and packaging knowledge with peers.

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with relevant packaging or CAD-automation experience.

Skills

Required:AI/ML workflow developmentPython
Nice to have:TclSKILLC++EDA packaging toolsDRC/LVS familiarity

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 22, 2026. Interested? Apply on the company site.
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