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Technical Program Manager, Thermal & Mechanical Engineering

AMD· Engineering
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Hybrid (Penang)Full-timePosted 5d ago

About the role

Lead thermal, mechanical and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and production ramp. Coordinate package, board, cooling and chassis integration and manage regional supplier and engineering collaboration to support product schedules.

Responsibilities

  • Define program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.
  • Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.
  • Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.
  • Plan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.
  • Coordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.
  • Manage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.
  • Drive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.

Qualifications

  • Substantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.
  • Proven delivery from engineering development through qualification and production ramp.
  • Working knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.
  • Understanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.
  • Experience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.
  • Experience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.
  • Proficient in English, technical writing and executive communication skills.
  • High-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.

Skills

Required:Program managementThermal and mechanical engineering understandingRisk and change management
Nice to have:DFM/DFA reviews

Benefits

  • Benefits offered are described: AMD benefits at a glance.
Last updated Oct 22, 2026. Interested? Apply on the company site.
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