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Camera Module Design Lead

Apple· Hardware
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ShanghaiFull-timePosted 3d ago

About the role

Lead a multi-disciplinary hardware engineering effort to design, develop, and qualify high-performance camera modules and depth-sensing hardware for Apple products, coordinating across optical, electrical, mechanical, process, controls, sensing, test, and manufacturing teams.

Responsibilities

  • Definition and trade-off studies of RGB camera and depth-sensing optics, sensors, actuator, and packaging.
  • Interaction with optical, electrical, process, controls systems, sensing, test, and mechanical teams on integration of camera/depth-sensing hardware into products.
  • Leadership of offshore manufacturing partners on camera/depth-sensing design evaluation, product prototype builds, and qualification.
  • Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures.
  • Evaluation and debugging of camera/depth-sensing HW at module and product levels for Camera Design and Integration.
  • Documentation of camera-specific design, test, and manufacturing requirements.
  • International travel may be required to supplier facilities for product development and production bring-up.

Qualifications

  • BSc/MSc/PhD in relevant field (Electrical Engineering, Mechanical Engineering, Optics, Physics, Materials or equivalent).
  • For BSc candidate, 3+ years working experience in optomechanical products or semiconductor is preferred
  • Ability to lead a multi-functional team of engineers and scientists with unique background and technical expertise through the R&D phase of product development from concept to mass production.
  • Ability to influence cross-functional teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule.
  • Able to communicate and convey ideas clearly and concisely.
  • The applicant will also be familiar with at least 3 of the skills listed below:
  • Camera module or imaging system design and architecture, including optical components, optical sensing, and system integration.
  • Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
  • Electronic circuit and system design including power delivery, high-speed signal integrity, electrical integration of sensor interfaces.
  • Understanding of geometric optics and image quality evaluation, including test charts, algorithms, and lighting.
  • Image/depth sensor design or characterization.
  • Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
  • Failure analysis techniques including optical microscopy, X-ray, CT scans, SEM, etc.
  • Ability in root-cause and corrective-action analysis.
  • Proficiency in statistical analysis, data reporting, and visualization.
  • Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.

Skills

Required:Camera module or imaging system design and architectureDesign and tolerance analysis of actuators or translational mechanismsElectronic circuit and system design
Nice to have:Geometric optics and image quality evaluationImage/depth sensor design or characterizationCompact module manufacturing processesFailure analysis techniquesRoot-cause and corrective-action analysisStatistical analysis, data reporting, and visualization

Benefits

  • Apple's equal opportunity employment commitment.
Last updated Oct 23, 2026. Interested? Apply on the company site.

About Apple

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

Discover the innovative world of Apple and shop everything iPhone, iPad, Apple Watch, Mac, and Apple TV, plus explore accessories, entertainment, and expert device support.

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