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Network Engineer - ML Infrastructure (High-Speed Interconnects)

xAI· Infrastructure
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Palo Alto, CA$180k - $440kFull-timePosted 8mo ago

About the role

ML Infrastructure Engineer focused on high-speed interconnects to enable large-scale AI training and inference clusters. Design, build, and optimize copper and optical interconnects (200G+ SerDes, PAM4) across data centers, with emphasis on performance, power efficiency, and reliability for AI/ML workloads.

Responsibilities

  • Design, validate, and productize high-speed copper and optical connectivity solutions for AI clusters (100k+ GPU scale).
  • Own vendor due diligence and onboarding for new 1.6T products including AEC and pluggable optical transceivers (DR4/8, FR4) including rigorous bring-up & characterization.
  • Investigate the opportunity for LPO and LRO in our network.
  • Evaluate early co-packaged and near-packaged engines for switches and GPUs.
  • Pathfinding for new interconnect modalities including VCSEL, microLED, THz radio-based solutions to improve network economics and reliability.
  • Work closely with vendors (transceiver, cable, SerDes, DSP, silicon photonics foundries) to influence roadmaps and ensure timely delivery of next-gen solutions.
  • Collaborate with ML training teams to translate workload communication patterns into concrete interconnect topology and optical reconfigurability requirements.
  • Perform system-level simulation of end-to-end fabric performance.
  • Drive failure analysis, root cause, and corrective actions for interconnect-related issues in production clusters through fleet-level metrics gathering and analysis.
  • Contribute to internal tooling and automation for interconnect health monitoring, telemetry, diagnostics, remediation and automated qualification pipelines.
  • Stay current with industry standards (OIF CMIS, IEEE) and emerging technologies (multi-core/hollow-core fiber, 448G SerDes, TFLN, ring resonators)

Qualifications

  • At least 8+ years of hands-on experience in designing, deploying and operating high-speed copper and optical interconnects, preferably in a module design role or in a hyperscale datacenter environment.
  • Master's or PhD degree in Electrical Engineering, Photonics or Physics.
  • Deep knowledge of PAM4 SerDes performance, equalization, jitter, crosstalk.
  • Solid operational understanding of FEC, Retimers, TIAs and Drivers.
  • Deep knowledge of optical link budget analysis and performance metrics including TDECQ, OMA, Tcode, stressed receiver sensitivity and associated diagnostics.
  • Expertise in transceiver components including CW lasers, SiPh PICs, EML, DSP, passive subassemblies, their failure modes and characterization.
  • Knowledge of thermal, mechanical, power, signal integrity constraints in dense hardware.
  • Knowledge of SiPh design process, yield improvement and reliability testing.
  • Familiarity with CPO technologies and challenges/risk areas.
  • Familiarity with subcomponent supply chains and global manufacturers, ODMs and CMs.
  • Strong problem-solving skills and ability to thrive in a fast-paced, ambiguous setting.

Skills

Required:High-speed copper and optical interconnect designSystem-level simulation
Nice to have:Vendor management & collaboration

Benefits

  • equity
  • comprehensive medical, vision, and dental coverage
  • 401(k) retirement plan
  • short & long-term disability insurance
  • life insurance
  • various other discounts and perks
Last updated Oct 14, 2026. Interested? Apply on the company site.

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