Failure Analysis Engineer, Microelectronics (Starlink)
SpaceX· Starlink Process Engineering
Bastrop, TXFull-timePosted 6mo ago
About the role
Failure Analysis Engineer on the Starlink team performing root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns, using advanced laboratory tools and physics-of-failure techniques to identify failure mechanisms and drive corrective actions.
Responsibilities
- Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
- Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
- Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
- Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
- Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
- Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
- Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials
Qualifications
- Bachelor’s degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline
- 2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)
Skills
Required:Electrical fault isolation and characterizationPhysical failure analysisPhysics-of-failure / semiconductor failure modesTechnical reporting and documentation
Nice to have:Data analysis (Python, JMP or similar)
Last updated Sep 23, 2026. Interested? Apply on the company site.
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