Silicon Packaging Technician, Silicon Assembly (Starlink)
SpaceX· Starlink Production - Silicon Packaging
Bastrop, TXFull-timePosted 3mo ago
About the role
Role focused on in-house IC packaging and assembly for the Starlink program, supporting deposition, lithography, dicing, molding, die attach, plating, and ESD/cleanroom compliance in a fast-paced manufacturing environment.
Responsibilities
- Operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals & dielectrics as well as stripping and etching equipment
- Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy
- Monitor process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control
- Operate dicing saws, laser dicers, and plasma etching tools to perform mechanical, laser, or plasma-based singulation on wafers and large-format panels, following & monitoring recipes
- Load and unload materials into molding systems, following recipes to achieve target mold fill, void minimization, and flash control during production runs
- Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness
- Operate electrochemical plating tools, including copper electroplaters and seed layer systems, and stripping/etch equipment to process products according to recipes for uniform deposition and precise material removal rates.
- Comply with cleanroom gowning protocols (ISO), Chemical Safety Standards, & Strict Electrostatic Discharge (ESD) guidelines
Qualifications
- High school diploma or equivalency certificate
- 3+ years of professional experience in a hands-on manufacturing environment; OR associate's degree in an engineering, math or science discipline
Skills
Required:PhotolithographyElectrochemical platingDie attach
Nice to have:Molding and overmoldThin film depositionMetrology & inspection
Benefits
- [Not specified in the description]
Last updated Oct 7, 2026. Interested? Apply on the company site.
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