Semiconductor Product Engineering Team Leader
Hybrid (Bristol)full-timePosted 3mo ago
About the role
Senior Semiconductor Product Engineering leader to drive manufacturing test strategy and silicon production readiness for next-generation AI accelerator devices, leading internal product engineering teams and external partners across test development, characterization, yield optimization, and high-volume ramp.
Responsibilities
- Drive the manufacturing test strategy for an AI accelerator chip featuring PCIe Gen6, LPDDR, advanced CMOS nodes, and advanced packaging (e.g., 2.5D/3D, chiplet)
- Lead and manage a team of chip product engineers responsible for test planning, test program development, pattern bring-up, silicon characterization, debug, and optimization
- Manage subcontracted test development partners (OSATs, ATE vendors, external engineering services). Includes scoping, technical oversight, schedule tracking, and quality control of deliverables
- Define and drive test software architecture, DFT usage, and test pattern development strategies for high-speed logic, SRAM, DRAM, and High Speed IO blocks
- Work closely with design, DFT, manufacturing engineering, packaging, and validation teams to ensure robust test coverage, manufacturability, and yield ramp success
- Oversee test development for high speed interfaces such as PCIe Gen6 and multi-GHz LPDDR
- Guide development of structural and functional test content (scan, MBIST, JTAG, HSIO tests, system-level tests)
- Lead silicon bring-up and development on ATE: correlation, failure analysis, shmooing, corner testing, stress testing, and yield improvement activities
- Define KPIs and metrics for subcontractor performance, test coverage, yield, time-to-test, and cost optimization
- Drive continuous improvement in test methodologies, automation, data analytics, and debug infrastructure
- Ensure robust test flows for advanced packaging (thermals, interposer/bridge connections, TSV integrity, die-to-die IO testing)
- Support qualification, reliability testing, and high-volume manufacturing transfer
Qualifications
- BS/MS/PhD in Electronics and Electrical Engineering or related field
- 8+ years in semiconductor test engineering, including leadership or technical lead roles
- Experience with ATE test development (e.g., Advantest 93K, Teradyne Ultraflex or similar)
- Strong understanding of DFT (scan, ATPG, LBIST, MBIST), memory testing, and high-speed interface testing
- Experience managing external test development partners or OSATs
- Proven ability to lead and mentor test engineering teams
- Solid background in advanced CMOS nodes and familiarity with advanced packaging test challenges
- Expertise in silicon debug, characterization, and correlation across ATE and system-level environments
- Ability to collaborate across design, architecture, product engineering, packaging, and operations
Skills
Required:Manufacturing test strategyDFT/mock patterns
Benefits
- Private Medical, Dental and Vision
- Contributory Pension
- 25 Days holiday plus bank holidays and Life/Critical Illness Insurance
Last updated Aug 20, 2026. Interested? Apply on the company site.
About Fractile
Radically Accelerate Frontier Model Inference
Fractile is designing AI compute systems that will enable the next generation of AI scaling: frontier model inference, 25x faster, at 1/10th the cost.
frontier model inferenceAI computecompute systemsAI scalinginference hardwareprocessor innovation
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