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Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)

SpaceX· Mesh Optical
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Bastrop, TXFull-timePosted 2mo ago

About the role

Senior packaging engineer responsible for end-to-end packaging lifecycle, thermal materials, and integration for the Starmind AI satellite constellation. Role focuses on hardware enablement for on-orbit AI processing, collaborating across mechanical, thermal, materials, electrical, software, and supply chain teams.

Responsibilities

  • Own the full lifecycle of advanced packaging through board assembly process development— including requirements capture, materials selection, prototyping, process optimization, manufacturing, and failure analysis.
  • Drive system trades, requirements capture, materials selection, prototyping, manufacturing, failure analysis.
  • Spearhead the development integrated thermal solutions including next generation TIMs to improve package performance.
  • Own the full lifecycle of equipment specification, qualification, and ramp.
  • Build supply chains for die, packages, components, consumable chemicals, and equipment for satellite compute manufacturing. Define incoming acceptance criteria for components and materials.
  • Work closely with engineers from adjacent disciplines (mechanical, thermal, materials, electrical, software, test engineering, supply chain, silicon design, etc.) to deliver tightly integrated, high-performance hardware
  • Challenge assumptions, question requirements, learn from your mistakes, and approach problems with an open mind
  • Collaborate closely with leadership and stakeholders across all departments—including design, reliability, production, and supply chain to deliver best in class electronics.
  • Manage compliance risks, ensuring safety and environmental compliance with industry standards.
  • Mentor and develop engineers, providing technical guidance and project oversight.

Qualifications

  • Bachelor's degree in materials science, mechanical engineering, or similar discipline.
  • 5+ years experience in microelectronics device research or manufacturing.

Skills

Required:Packaging lifecycle managementMaterials selectionThermal managementEquipment qualification
Last updated Jul 29, 2026. Interested? Apply on the company site.

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