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Sr. Process Engineer - Wafer Level Assembly, AI Satellites (Starmind)

SpaceX· Mesh Optical
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Bastrop, TXfull-timePosted 2mo ago

About the role

Senior process engineer responsible for end-to-end hardware lifecycle in advanced packaging and wafer-level assembly for SpaceX's Starmind AI satellite program, collaborating across mechanical, thermal, materials, electrical, software, test, and supply chain to enable high-performance on-orbit AI compute.

Responsibilities

  • Own the full lifecycle of advanced packaging through board assembly process development— including requirements capture, materials selection, prototyping, process optimization, manufacturing, and failure analysis.
  • Own the full lifecycle of equipment specification, qualification, and ramp.
  • Build supply chains for die, packages, components, consumable chemicals, and equipment for satellite compute manufacturing. Define incoming acceptance criteria for components and materials.
  • Specify and implement in-process metrology tools for quality control. Integrate simulation tools with experimental data to guide and drive targeted process improvements.
  • Drive end-to-end process R&D programs, from concept through product implementation, to drive cost down, efficiency improvements, and reliability in electronic systems.
  • Work closely with engineers from adjacent disciplines to deliver tightly integrated, high-performance hardware.
  • Challenge assumptions, question requirements, learn from mistakes, and approach problems with an open mind.
  • Collaborate closely with leadership and stakeholders across all departments to deliver best in class electronics.
  • Manage compliance risks, ensuring safety and environmental compliance with industry standards.
  • Mentor and develop engineers, providing technical guidance and project oversight.

Qualifications

  • Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline.
  • 5+ years experience in microelectronics device research or manufacturing.

Skills

Required:Advanced packaging and board assembly process developmentEquipment specification, qualification, and rampSupply chain development for die, packages, components, and chemicalsIn-process metrology and data-driven process improvementCross-disciplinary collaborationProcess R&D program managementCompliance and safety thinking
Nice to have:Mentoring and technical leadership
Last updated Jul 29, 2026. Interested? Apply on the company site.

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