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Electrical CAD and Manufacturing Lead, Robotics Hardware Engineering

Meta· Robotics Hardware Engineering
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Redmond, WA$173k - $245kFull-timePosted 2mo ago

About the role

Lead the full lifecycle of PCB design, fabrication, and assembly for robotic subsystems. Establish design standards, libraries, and manufacturing processes to enable rapid prototype iteration and production-quality hardware delivery. Manage multi-layer PCB layouts, vendor coordination, and design release within a high-ambiguity, fast-paced robotics hardware environment.

Responsibilities

  • Lead and execute complex, multi-layer PCB layouts for robotic subsystems spanning high-speed digital, mixed-signal analog, power electronics, and RF domains across rigid, flex, and rigid-flex substrates
  • Own the end-to-end PCB manufacturing process from design rule definition through fabrication, assembly, and delivery — acting as the primary liaison between design engineering, component engineering, and external PCB fabrication/assembly vendors
  • Perform and lead DFM/DFA reviews, proposing design optimizations for manufacturability, yield, and reliability; establish and maintain standardized design rules, stack-up libraries, and process qualification criteria
  • Manage schematic symbol and PCB footprint libraries; ensure data integrity, version control, and compliance with internal standards and IPC/JEDEC specifications
  • Review and validate netlist-to-layout constraint mapping, ensuring design intent is accurately captured in physical implementation; resolve signal integrity, power integrity, thermal, and EMI challenges through placement, routing, and stackup
  • Coordinate and manage external PCB design resources during design surges; review and approve third-party layout work for quality and compliance
  • Drive vendor strategy for PCB fabrication and assembly — qualify new suppliers, negotiate capabilities, manage technical queries (TQs/EQs), and oversee build schedules across multiple concurrent projects
  • Establish and improve processes for design release, archival, BOM management, and documentation packages (fabrication drawings, assembly drawings, pick-and-place files, test points)
  • Recruit, mentor, and manage the design quality of engineers on the team

Qualifications

  • 7+ years of experience in PCB layout design and manufacturing engineering, with demonstrated leadership of complex multi-layer board designs from concept through production
  • Associates degree in Electrical Engineering, Electrical Engineering Technology, or equivalent experience
  • Expert proficiency in Cadence Allegro, including constraint management, impedance-controlled routing, and design rule configuration
  • Experience across multiple PCB technologies: HDI, rigid, flex, and rigid-flex
  • Experience designing high-speed differential circuits, power distribution networks, analog signal chains, and RF circuits with appropriate isolation and grounding strategies
  • Strong working knowledge of IPC, JEDEC, and other electronic manufacturing standards
  • Experience managing PCB fabrication and assembly vendor relationships, including stack-up negotiation, material selection, DFM resolution, and build coordination
  • Experience creating and maintaining schematic symbols, PCB footprints, and component libraries in enterprise library management systems
  • Proficiency in creating complete documentation packages: fabrication drawings, assembly drawings, BOM, and Gerber/ODB++ outputs
  • Proficiency in ECAD/MCAD collaboration workflows (3D model exchange, board outline coordination)
  • Strong communication and organizational skills with proven ability to manage multiple concurrent projects and stakeholders

Skills

Required:PCB layout designCadence AllegroDFM/DFI/DFM reviewsSchematic and footprint library managementVendor managementSignal integrity / Power integrity / EMIDocumentation and BOMECAD/MCAD collaborationProject and stakeholder management

Benefits

  • Benefits information linked in job description (to be retrieved from Meta’s benefits page)
Last updated Oct 23, 2026. Interested? Apply on the company site.

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