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Advanced Package Technology Principal Engineer

Lumilens· Engineering
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San JoseFull-timePosted 2mo ago

About the role

Experienced IC Package Mechanical FEA Engineer to drive next‑gen high‑performance packaging solutions for advanced ASICs, collaborating with global R&D, manufacturing, reliability, and external vendors to optimize thermo‑mechanical performance of multi‑chip‑module and FC‑BGA packages.

Responsibilities

  • Perform FEA simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across advanced package architectures (flip‑chip, fan‑out, 2.5D/3D IC, chiplet‑based, TSVs).
  • Define simulation requirements, analyse results, and deliver actionable design and process recommendations.
  • Support technology road mapping by assessing new materials, interconnect structures, and process flows from a thermo‑mechanical reliability perspective.
  • Lead DOE studies and sensitivity analyses to identify key reliability and performance drivers.
  • Collaborate with cross‑functional teams (design, photonics, manufacturing, reliability, vendors) to ensure robust, scalable package architectures.

Qualifications

  • Bachelor’s in Mechanical Engineering (or related field) with 12+ years FEA experience, Master’s with 10+, or PhD with 7+.
  • Deep expertise in advanced packaging technologies, including flip‑chip, FOWLP, 2.5D/3D integration, chiplet architectures, and TSVs.
  • Strong understanding of materials behavior across polymers, metals, ceramics, and their thermo‑mechanical interactions.
  • Familiarity with semiconductor packaging processes such as die attach, underfill, molding, bumping, and reflow.
  • Proficiency with FEA tools, including Ansys Classic/Mechanical and Abaqus.
  • Ability to interpret and correlate complex simulation results using first‑principles mechanical engineering concepts.
  • Demonstrated experience calibrating models with empirical data, including hands‑on mechanical testing and metrology.
  • Proven capability in developing and running lab‑level experiments to validate simulations and identify root causes.
  • Strong judgment in balancing manufacturing constraints, reliability requirements, and performance needs.
  • Excellent self‑management, organizational discipline, and ability to thrive in a fast‑moving environment.
  • Comfortable collaborating with global, cross‑functional engineering teams and external vendors.
  • Strong presentation, communication, and technical documentation skills.

Skills

Required:Finite Element Analysis (FEA)Packaging technologiesMaterials scienceDie attach/underfill/molding/bumping/reflow
Last updated Aug 8, 2026. Interested? Apply on the company site.

About Lumilens

Connectivity Platform for AI

Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.

Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
Company profileWebsite

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