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Die Attach Manufacturing Engineer- Process & Equiment

Lumilens· Operations
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SingaporeFull-timePosted 2mo ago

About the role

Mid-to-senior level Manufacturing Engineer focusing on die attach processes and equipment for Photonic Integrated Circuits (PICs) and silicon photonics dies, including alignment-based bonding, epoxy/adhesive dispense, and solder attach, with emphasis on sub-micron placement accuracy, optical coupling yield, and NPI support.

Responsibilities

  • Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
  • Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.
  • Lead root cause analysis and implement CAPA for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control).
  • Support NPI by developing die attach process flows for new photonic packages, transceiver modules, and hybrid/co-packaged integration platforms.
  • Monitor SPC/process capability (Cpk) data on placement accuracy, bond-line thickness, and optical coupling efficiency; drive process improvements to reduce variation and coupling loss.
  • Evaluate and qualify optically-compatible die attach materials with Materials and Optical Design Engineering.
  • Partner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing.
  • Support development of active alignment processes with real-time optical feedback during die bonding.
  • Own equipment performance, uptime, and OEE for photonics die attach tools; lead installation, qualification, and ramp-up for new/upgraded tools.
  • Maintain preventive maintenance plans, troubleshoot high-precision equipment, minimize downtime.
  • Collaborate with vendors for tool upgrades, retrofits, spare parts, and technical escalations.
  • Drive automation and fixture improvements for throughput while maintaining alignment tolerances.
  • Support equipment capacity planning and CAPEX proposals.
  • Collaborate with Design, Product, Quality, and Operations to align process capability with product requirements.
  • Provide technical training to manufacturing technicians and operators.
  • Support process/equipment documentation for audits.
  • Track KPIs: yield, Cpk, uptime, scrap rate, cycle time; engage in cost reduction and Six Sigma/CI initiatives.

Qualifications

  • Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field (Master's preferred for senior roles)
  • 3–7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging
  • Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement
  • Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes (coupling loss, epoxy haze, bond-line drift, facet damage)
  • Experience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent)
  • Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone) for optical coupling yield and alignment accuracy
  • Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration) and their die attach/alignment needs
  • Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances
  • Ability to read/interpret optical/mechanical engineering drawings, specs, and manuals

Skills

Required:Die attach process engineeringActive/passive alignment epoxy attachAuSn/eutectic solder attachFlip-chip bondingProcess capability (Cpk) and DOENPI for photonic packages

Benefits

  • Competitive salary and benefits package
  • Work on cutting-edge photonics packaging technology
  • Collaborative, cross-functional engineering environment
  • Career growth within process/manufacturing engineering
  • Lumilens is an equal opportunity employer committed to diversity and inclusion.
Last updated Aug 8, 2026. Interested? Apply on the company site.

About Lumilens

Connectivity Platform for AI

Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.

Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
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