Component Process Engineer Singapore
Lumilens· Operations
SingaporeFull-timePosted 2mo ago
About the role
Hands-on Component Process Engineer serving as the primary substrate engineering interface between hardware design, package manufacturing, and substrate suppliers. Focuses on FR4 substrate/PCB development, process development, and supplier qualification for high-speed optical transceiver applications, with emphasis on mSAP/HDI/Any_Layer processes and DFM-based collaboration with suppliers.
Responsibilities
- Identify, develop and qualify FR4/PCB substrate suppliers worldwide.
- Lead DFM/DFT/DFR of PCB substrates, risk analysis and mitigation plan with suppliers.
- Lead FR4/PCB quality control, failure analysis and reliability tests.
- Engage with packaging production teams during the process development from SMT, die attach, wire bond, active alignment and testing.
Qualifications
- B.S. or M.S. in Material, Chemistry or Mechanical Engineering.
- 8+ years of working experience in FR4 substrate or PCB development or manufacturing, with in-depth knowledge in mSAP process, Any-Layer HDI process, for high-speed optical transceiver applications.
- Must be very familiar with all the equipment, typical materials and the typical process capabilities.
- Familiar with PCB layout tools such as Cadence, mechanical design tools such as Solidworks, statistical tools such as JMP.
- Working knowledge of PCB test methodologies.
- Familiar with FMEA, Control Plan, SPC, 8D, etc.
- Fluency in English to communicate with English speaking stakeholders.
- 30~50% travel in Asian countries.
Skills
Required:FR4 substrate/PCB developmentmSAP/HDI/Any-Layer HDIDFM/DFT/DFRQuality and reliabilityPackaging process collaborationTools
Benefits
- Competitive salary and meaningful equity in a high-growth company
- Comprehensive health, dental, and vision coverage
Last updated Aug 22, 2026. Interested? Apply on the company site.
About Lumilens
Connectivity Platform for AI
Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.
Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
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