Principal Mechanical Engineer
Lumilens· Engineering
Bengaluru, IndiaFull-timePosted 2mo ago
About the role
Senior-level mechanical engineering role focused on architecture, design, development, and industrialization of OSFP optical transceiver modules (800G, 1.6T) for high-speed photonic systems, with emphasis on thermal management, EMI/EMC, precision design, and large-scale NPI/production.
Responsibilities
- Lead end-to-end mechanical design and development of OSFP transceiver modules and related hardware
- Define module architecture, stack-up strategy, mechanical interfaces, retention mechanisms, heat spreaders, cages, and thermal paths
- Design precision components using sheet metal, die castings, injection molded plastics, CNC machined parts, and TIMs
- Optimize designs for thermal performance, structural integrity, EMI shielding effectiveness, manufacturability, reliability, and cost
- Drive advanced thermal solutions for high-power DSP and optical engines
- (Optional) Perform thermal simulations using FloTHERM, Icepak, and CFD tools
- Develop cooling strategies involving heat sinks, vapor chambers, heat spreaders, liquid cooling interfaces, and advanced TIM selection
- Lead reliability validation including thermal cycling, mechanical shock/drop, vibration, HALT/HASS, and environmental testing
- Define GD&T strategy and tolerance stack-up analysis for critical thermal and optical interfaces
- Design EMI shielding solutions including conductive gaskets, coatings, and grounding strategies
- Drive NPI activities from concept through mass production
- Establish DFM/DFA guidelines, assembly processes, quality controls, and automation opportunities
- Lead supplier qualification and manufacturing transfer activities
- Support yield improvement and root-cause analysis using 8D, DMAIC, Fishbone, and DFMEA/PFMEA
- Mentor and technically lead engineering teams
Qualifications
- Bachelor’s or Master’s degree in Mechanical Engineering or related field
- 12–20+ years of experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware
- Strong expertise in OSFP/QSFP mechanical systems, thermal management, and precision design
- Proficiency in Creo, SolidWorks, or NX CAD tools
- Strong understanding of GD&T, tolerance analysis, material science, EMI/EMC, and reliability engineering
Skills
Required:Mechanical architecture leadershipThermal design and (optional) simulationNPI & manufacturing transferSupplier managementDFMEA / PFMEARoot cause analysisProgram leadershipExecutive-level technical presentation
Benefits
- Competitive salary and significant equity in a high-growth company
- Comprehensive health, dental, and vision insurance
- Flexible time off policy
- Direct impact on groundbreaking technology shaping the future of AI and data centers
- Opportunity to work with a highly experienced and collaborative team
- Dynamic and innovative work environment
- Opportunity for rapid career growth
Last updated Aug 8, 2026. Interested? Apply on the company site.
About Lumilens
Connectivity Platform for AI
Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.
Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
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