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Wire Bond-Manufacturing Engineer

Lumilens· Operations
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SingaporeFull-timePosted 2mo ago

About the role

Manufacturing Engineer specializing in wire bond processes and equipment for semiconductor packaging, focusing on process development, qualification, optimization, and sustaining activities across ball, wedge, and ribbon bonding to achieve high yield, reliability, and throughput.

Responsibilities

  • Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems
  • Establish and maintain process specifications, bond recipes, work instructions, and control plans
  • Lead root cause analysis and CAPA for wire bond process yield losses and defects
  • Support NPI by developing new wire bond process flows, including DOE-driven process windows
  • Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)
  • Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving
  • Own uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)
  • Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH
  • Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders
  • Collaborate with equipment vendors for technical escalations and upgrades
  • Plan preventive maintenance and spare parts strategy
  • Partner with Quality and Reliability teams on failure analysis for field and customer returns
  • Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions
  • Ensure compliance with IPC/JEDEC standards and customer requirements
  • Work closely with Product/Design Engineering for bond pad layout and substrate design
  • Partner with Process Integration, Test, and Quality to resolve yield and reliability issues
  • Support cost reduction initiatives and train operators/technicians on process and equipment
  • Maintain process control documents, FMEAs, control plans, and traceability as per quality management systems (ISO 9001 / IATF 16949 / AS9100)
  • Support internal and customer audits related to wire bond processes and equipment

Qualifications

  • Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering
  • 3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)
  • Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes
  • Experience with DOE, SPC, and root cause/CAPA methods
  • Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)
  • Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)
  • Strong analytical, troubleshooting, and cross-functional communication skills
  • Willingness to support shift or production floor needs

Skills

Required:Wire bonding processesDOESPCCAPA
Nice to have:FMEA

Benefits

  • Competitive salary and benefits package
  • The opportunity to work on cutting-edge semiconductor packaging technology
  • A collaborative, cross-functional engineering environment
  • Career growth within the manufacturing/process engineering track
Last updated Aug 8, 2026. Interested? Apply on the company site.

About Lumilens

Connectivity Platform for AI

Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.

Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
Company profileWebsite

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