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Senior/Staff Quality Assurance Engineer or Manager (OSAT)

Lumilens· Operations
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SingaporeFull-timePosted 2mo ago

About the role

Senior/Staff Quality Assurance Engineer or Manager focused on quality management, problem solving, process control, supplier & customer quality, and audits within semiconductor assembly and test (OSAT). Based in Singapore; full-time role.

Responsibilities

  • Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.
  • Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.
  • Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).
  • Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools.
  • Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints.
  • Support failure analysis activities and coordinate with engineering teams for resolution.
  • Monitor process capability using SPC methodologies.
  • Analyse yield, defect trends, and reliability data.
  • Lead continuous improvement projects to reduce defects and improve yield performance.
  • Support supplier audits and qualification activities.
  • Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT.
  • Manage the change control request review and approval, related to materials, processes, and equipment.
  • Conduct internal and external quality audits.
  • Support customer audits and certification activities.
  • Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.

Qualifications

  • Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.
  • 5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs.
  • Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly.
  • Wafer & Final Test quality experience is an added advantage.

Skills

Required:Statistical Process Control (SPC)Failure Analysis (FA)FMEA / PFMEACAPA8D Problem SolvingDOE (Design of Experiments)Yield Analysis & Defect ReductionReliability EngineeringQMS ISO 9001, IATF 16949
Nice to have:Minitab, JMP, Excel, SQL
Last updated Aug 8, 2026. Interested? Apply on the company site.

About Lumilens

Connectivity Platform for AI

Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.

Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
Company profileWebsite

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