Senior/Staff Process Engineer (Flip Chip)
Lumilens· Operations
SingaporeFull-timePosted 2mo ago
About the role
Senior/Staff Process Engineer responsible for development and technical support of the Flip Chip process for silicon photonic chip wafers, including DOE, material qualification, reliability testing, failure analysis, material quality control, and NPI support.
Responsibilities
- Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
- DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.
- Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
- Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
- Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.
- Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.
- Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.
Qualifications
- Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
- Experience: 5+ years of hands-on industry experience in flip chip assembly.
Skills
Required:plasma cleaningflux engineeringpick & placereflowunderfillTCB/NCP flux-less flowfinite element simulationFMEA and SPC8D problem-solvingJMP/Minitab
Last updated Oct 10, 2026. Interested? Apply on the company site.
About Lumilens
Connectivity Platform for AI
Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.
Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
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