Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)
Lumilens· Operations
Bulim SquareFull-timePosted 2mo ago
About the role
Process Engineer to support volume manufacturing ramp-up in microelectronics packaging, optical module assembly, and high-precision automation lines at Lumilens’ Bulim facility, focusing on process development, qualification, yield optimization, and continuous improvement across DB, WB, AA, and end-to-end line integration.
Responsibilities
- Process Setup & Optimization: Establish robust process windows, parameter recipes, and SOPs for assigned production modules (DB, WB, AA, or End-to-End Line Integration).
- Yield & Defect Reduction: Monitor line yield metrics, lead 8D root-cause failure analysis (FA), and implement corrective actions for recurring process/equipment defects.
- NPI to Mass Production: Partner with NPI and Equipment Engineering to qualify new tooling, materials (epoxies, substrates, bonding wire), and automation platforms for high-volume ramp.
- Statistical Process Control: Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost-efficiency initiatives.
- Cross-Functional Collaboration: Work with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops and uphold quality standards.
Qualifications
- Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
- Experience: 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, SMT, or camera/optical module manufacturing.
Skills
Required:Die Bond (DB)Wire Bond (WB)Active Alignment (AA)Overall Process
Benefits
- Competitive salary and benefits
- Opportunities for career advancement
- Work with a world-class team solving cutting-edge challenges
- Collaborative and innovative work environment
Last updated Aug 22, 2026. Interested? Apply on the company site.
About Lumilens
Connectivity Platform for AI
Lumilens provides next-gen photonic interconnects for massively scaling out – and scaling up – AI compute infrastructure.
Photonic InterconnectsNext-Gen ManufacturingSystem-level knowledgeLumicore platformCPO/SiPh manufacturing
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